Industry: Semiconductors
Founded: 1990
Type: Public Company
Size: 201-500 Employees.
Address: 3025 Orchard Pkwy, San Jose, CA 95134, USA
Specialities: High-performance mobile packaging, Imaging and video technology, Memory circuit technology, 2.5D & 3D IC Solutions for Mobile, Advanced auto focus solutions, 3D
Categories: 3D
Tessera® was founded in New York in 1990 by ex-IBM scientists with a vision to create multichip systems differently. Thus was born the chip-scale package. For more than 20 years, Tessera has been a leader in innovating and licensing technology and intellectual property. As the company has grown and evolved, we’ve expanded our business through the acquisition of FotoNation® and the formation of InvensasTM. Our global footprint of approximately 200 employees includes approximately 120 engineers and scientists, of whom approximately 80 hold advanced degrees. Headquartered in San Jose, Calif., Tessera has generated more than $2 billion in revenue since our November 2003 NASDAQ (TSRA) IPO.

Tessera’s inventions are found in 100 percent of today’s smartphones and a broad range of electronic devices, from wearables to data centers. Our innovations and intellectual property in semiconductors, semiconductor packaging and advanced imaging enable our customers to deliver world-class digital user experiences in mobile, the cloud and the home.

FotoNation (www.fotonation.com) innovates and delivers embedded imaging products, to improve picture quality, enhance the user experience and enable still and video analytics. FotoNation’s software algorithms and semiconductor IP cores are found in approximately 60% of all Tier 1 smartphones, and are being embraced and rapidly adopted in emerging markets as well.

Invensas (www.invensas.com) enables tomorrow’s semiconductor technologies through inventive solutions today. This is done by inventing, productizing and acquiring intellectual property. Invensas is a recognized leader in the development of novel next-generation semiconductor solutions such as 2.5D and 3D integrated circuits and advanced die and package stacking technologies.

For information call 1.408.321.6000 or go to www.tessera.com.