NANIUM S.A

NANIUM S.A

NANIUM S.A

Founded: 2010
Type: Privately Held
Size: 501-1000 Employees.
Address: Av. Primeiro de Maio, 801 Vila do Conde, 4485-629 Portugal
Specialities: Fan-Out Wafer Level Packaging, Packaging & Assembly, Wafer-Level Chip Scale Package (WLCSP), Test Services, Wafer Level Services up to 300 mm wafer diameter, Failure Analysis and Reliability Laboratories
Categories: Uncategorised
NANIUM (www.nanium.com) is an outsourced semiconductor packaging, assembly and test provider, and a world-leader in 300mm Wafer-Level Packaging. The company provides Wafer-Level Chip Scale Packaging (WLCSP) and was among the first in the world to offer Wafer-Level Fan-Out (WLFO) packaging in high volume manufacturing. Nowadays, NANIUM stands as a leader in WLFO, a technology that combines minimal form-factor with superior performance, high integration density, and maximum reliability. To date, NANIUM has shipped over 550 million WLFO packages.
NANIUM delivers world-class services and always customizes them according to the customers’ needs. In this way, its WLFO embedded integration solutions range from single- to multi-die, system-in-package and package-on-package with passives integration, and serve markets such as mobile communication, medical, security, wearables and automotive radars, to name a few. The company is acknowledged for its proficiency in advanced packaging and known for its portfolio of innovative solutions, which includes the largest WLCSP in the world or the most compact WLFO Multi-Chip Module in the medical market.
Based in Portugal, NANIUM’s facilities include over 20,000 m2 of cleanroom area. The company offers in-house capabilities for the entire development chain, from design to the flexibility to tailor and test solutions. NANIUM has sales offices in Dresden, Germany, and Boston, USA.